(Nikkei BP Group)
(No.1 High-Tech News Site in Japanese)
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| Selete's 300-mm Wafer Technology Behind Schedule
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February 12, 1999 (TOKYO) -- Semiconductor Leading Edge Technologies
Inc. (Selete), a research group co-established by Japan's semiconductor
makers, said its development of 300-mm wafer technologies is one year
behind the initial schedule.
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Selete
was established in 1996 by 10 domestic semiconductor makers for the
purpose of development of semiconductor manufacturing equipment and
materials for a 300-mm wafer.
Ken-ichi Kawashima, director and general manager of Selete's Manufacturing
Technology Research Department, gave several reasons for the slippage
during a lecture on the technology at "The Industry Strategy Symposium
Japan '99" held in Narita, Chiba prefecture, near Tokyo.
After the schedule was established, the semiconductor market rapidly
worsened. In addition to the slowing down of 300-mm wafer technology
development by each manufacturer, Selete's evaluation of manufacturing
equipment did not progress as planned.
According to Kawashima, Selete almost completed evaluation of processing
performance of the equipment, and was about to proceed to evaluate its
productivity.
He named etching systems, metal deposition systems and chemical mechanical
polishing equipment to be improved on the basis of Selete's evaluation.
He also pointed out the necessity in improving local cleaning technologies,
and added that Selete plans to tackle that with the evaluation of an
automatic guided vehicle in the future.
Related stories:
Selete Pushes Evaluation of 300mm Wafer Transport
System
Development of 300mm Wafer Tech Aims at Production
in 2000
(Nikkei
Microdevices)
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