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2003_Jan-31: Microsoft Japan Pres. Says 10 Companies Infected by 'SQL Slammer' Worm in Japan
2003_Jan-31: NTT Group to Run Trial Videophone Service Linking PCs with FOMA Mobile Phones
2003_Jan-31: Number of Internet Banking Subscribers in Korea Up by 6.4 Mln. in 2002
2003_Jan-31: Pantech Wins US$100 Million Order from China's Ningbo Bird
2003_Jan-31: Analog Devices Unveils Low Distortion, Rail-to-Rail Input/Output Amps
2003_Jan-31: Tyco Launches Resettable Devices for Automotive, Industrial Applications
2003_Jan-31: Hudson to Begin Mobile Phone Content Distribution in China
2003_Jan-30: KDDI to Debut Download Service for BREW-Enabled Mobile Phone in Feb.
2003_Jan-30: MIT's 'Wireless Barcode Center' to Establish Japanese Beachhead
2003_Jan-30: E-Watermark in Music Files Traceable, JASRAC, RIAJ Say
2003_Jan-30: Samsung Electronics Develops 72Mb DDR3 SRAM
2003_Jan-30: Hitachi Global Storage Opens Corporate Center in Singapore
2003_Jan-30: Japan's PC Shipments Drop; NEC, Fujitsu Vie for Market Lead
2003_Jan-30: Philips' Repeaters Expand Use of I2C Bus in Computing, Telecom and Networking
2003_Jan-30: IMEC Begins Construction of 300mm Research Fab
2003_Jan-29: Intel, Fujitsu to Cooperate on Advanced Linux Server Development
2003_Jan-29: LG Electronics Releases New W-CDMA Handset
2003_Jan-29: TSMC Logs 23% M-O-M Sales Drop, Production at 61% of Capacity for Q4
2003_Jan-29: Samsung Electronics Sets Goal to Become World's Biggest Flash Memory Chip Supplier
2003_Jan-29: SiGe's 802.11b/g Power Amp Improves Transmission Range of WLAN Systems
2003_Jan-29: TDK Launches SoC for EMV Smartcard Terminals
2003_Jan-29: ERNI Offers High-Density Pitch Connectors in 68 and 80 Position
2003_Jan-29: Sanyo to Launch 3-D Portrait Service Overseas
2003_Jan-28: Sony, Three Others Establish Company for Distributing Music to Home Appliances
2003_Jan-28: PC Shipments in Japan Decline for Second Straight Year in 2002
2003_Jan-28: LG Electronics to Invest US$1.35 Billion in Digital TV Business
2003_Jan-28: Fujitsu, AUO of Taiwan to Ally on LCD Operations
2003_Jan-28: TI Launches Chip Made on Advanced 90nm Process
2003_Jan-28: Vishay Offers RF Diodes in Compact SOD523 Package
2003_Jan-27: Bluetooth to Step Up to Mass Production Stage in 2003: Bluetooth SIG
2003_Jan-27: Sony Selects Philips' USB On-the-Go Chip for CLIE Handheld Device
2003_Jan-27: SkyPerfect to Start IPv6-Based Satellite Comm Services
2003_Jan-27: Microchip's New MCU Family Simplifies Motor-Control Design
2003_Jan-27: Vishay's Tantalum Chip Capacitors Offer Capacitance of 1,500microF, ESR Values of 13mili-ohms
2003_Jan-27: ERNI Introduces CAN Switch Metal Housing with Axial Cable Outlet and Switch
2003_Jan-26: Softbank Unveils IP Phone with ADSL, Wireless LAN Functions
2003_Jan-24: NEC's New Tablet Computer Weighs Just 1kg
2003_Jan-24: Sanyo Unveils Mobile Phone with Organic EL Panel Designed for KDDI
2003_Jan-24: Sony Develops Fingerprint Recognition Module for Memory Stick
2003_Jan-24: Spot Price of DDR DRAM Falls Below US$5
2003_Jan-24: SK Telecom Enjoys Higher Sales, Net Profits in 2002
2003_Jan-24: Motorola Strengthens Its Base in Korea
2003_Jan-23: Toshiba, Matsushita Kobobuki Tie Up for Production of Small HDDs
2003_Jan-23: Seagrand to Introduce Ultra-Thin Audio Player
2003_Jan-23: Fujifilm CCD Enhances Digital Camera Color Reproduction
2003_Jan-23: Korea Telecom Sets 2003 Sales Goal at 12 Trillion Won
2003_Jan-23: ST Unveils New Application-Specific Flash Memory Devices
2003_Jan-23: Lightconnect, ZTE Partner to Deliver Intelligent Optical Networks
2003_Jan-22: Long-Lasting FOMA Cell Phones Debut; Development Costs Cut by NTT DoCoMo
2003_Jan-22: Chinese Makers Display MPEG-4 DVD Players at Int'l Consumer Electronics Show
2003_Jan-22: KTF Aims to Post 550 Bln. Won of Net Profit in 2003
2003_Jan-22: Battle for Dominance in Digital Consumer Electronics Market Intensifies
2003_Jan-22: Sanyo Elec. to Boost CCD Output by 400% for Camera-Equipped Handsets
2003_Jan-22: Micron, NetLogic to Produce Pin-and-Function Compatible TCAM Devices
2003_Jan-22: Datang, Philips, Samsung Form JV to Deliver TD-SCDMA Chipset, Reference Design
2003_Jan-22: SiGe, IBM Sign Agreement on Cellular Power Amps
2003_Jan-21: Xilinx's Japanese Business Stays in Top Shape Despite Chip Recession
2003_Jan-21: JBCC to Enter Software Business in China
2003_Jan-21: TI's ADCs Deliver 16-bit No Missing Code Performance at 1.25MSPS
2003_Jan-21: ON Semiconductor Unveils High-Speed Multiple Signal Translator
2003_Jan-21: S3 Mobile Graphics Processor Delivers Advanced Hi-Def DX9 Video Performance
2003_Jan-21: IBM Japan to Offer SCM Services for Japan Firms in China
2003_Jan-20: Ghosn Stresses Law of Revival -- "Threat to Japan Lies Within"
2003_Jan-20: Samsung Electronics Enjoyed Record High Sales in 2002
2003_Jan-20: SK Telecom Begins Wireless Internet Biz in China
2003_Jan-20: Omron Unveils Print Station Service for Cell Phones With Cameras
2003_Jan-20: Sony to Assemble LCDs in China
2003_Jan-20: Seiko Epson's VCSO Provides Direct Oscillation in 2GHz Band
2003_Jan-20: Agere's Read-Channel Chip Enables High-Capacity Desktop, Mobile HDDs
2003_Jan-20: Monterey to Distribute 2nd Generation Physical Synthesis Solution in Russia
2003_Jan-19: NEC's China Microchip Venture to Resume Capacity Expansion
2003_Jan-17: NEC, Fujitsu Introduce Smart Display for Remote PC Control
2003_Jan-17: Orders Inundate Shimadzu for Sheet Capable of Turning Cell Phone Display into Mirror
2003_Jan-17: CSR, SiGe Enter Supply Agreement to Support Bluetooth Class 1 Designs
2003_Jan-17: Micron Introduces Ternary Content Addressable Memory Products
2003_Jan-17: Tsinghua Unisplendour Group Launches New Notebook with Crusoe Processor
2003_Jan-17: ANALYSIS: Electronics Firms to Profit from Chip Market Rally
2003_Jan-16: NTT DoCoMo Starts Developing Downlink High Speed Packet Transfer Technology for FOMA
2003_Jan-16: Samsung Electronics Becomes World's Second-Largest Chipmaker
2003_Jan-16: KDDI R&D; Lab Develops SVG Browser for Mobile Phones
2003_Jan-16: LG Telecom Moving to Offer 3G Mobile Services
2003_Jan-16: National Semiconductor Offers Solution for Microsoft's SPOT Initiative
2003_Jan-16: IR Introduces Power MOSFETs with Low On-Resistance in D-Pak Package
2003_Jan-16: Craft to Supply Mobile Phone Mold Prototypes in Korea
2003_Jan-16: NI Unveils 16-Bit Multifunction I/O DAQ Devices
2003_Jan-15: Plala to Leverage Equipment of NTT Regional Cos. to Challenge IP Phone Power Map in Japan
2003_Jan-15: Chipmakers Cranking Up Production of New Semiconductors
2003_Jan-15: Public Wireless LAN Services Pick Up Speed in AP, Says Gartner
2003_Jan-15: Magic4 Licenses EMS, MMS Client to Compal's Mobile Products
2003_Jan-15: Raychem's Lead-Free Resettable Device Features Insulating Coating
2003_Jan-14: Hewlett-Packard Japan's Nonstop Server Adopted for KDDI's E-Mail System
2003_Jan-14: Agere, Samsung Reach US$150 Million Wireless Chipsets Agreement
2003_Jan-14: Intel's XScale-Based Processors to Power New Smart Displays
2003_Jan-14: LG Electronics to Expand its Base in Chinese Market
2003_Jan-14: SiGe Semiconductor's Power Amp Targets Cordless Phone Applications
2003_Jan-14: AquaCast, TV Tokyo to Distribute News Programming via FOMA
2003_Jan-13: Samsung Attracts Enthusiastic Attention: A Follower or a Threat?
2003_Jan-13: Matsushita Electric Works to Debut 3D Image Display System
2003_Jan-13: Healing Robot Market for Elderly Shows Promise
2003_Jan-13: Samsung Electronics to Supply Notebook PCs to Dell Computer
2003_Jan-13: IR Unveils 300V MOSFET Replacement for Electro-Mechanical Relays
2003_Jan-13: TI Launches Precision Current Shunt Modulator for Motor Control
2003_Jan-10: Films Retain 'Konica' Brand, Cameras 'Minolta': Konica-Minolta Management Integration
2003_Jan-10: NTT to Sell Broadband-Compatible PCs 10 Pct. Cheaper than Dell
2003_Jan-10: UK to Strengthen Opto-Electronics Status via Merger
2003_Jan-10: Tektronix' Ethernet Compliance Test Software Speeds Validation, Improves Reliability
2003_Jan-10: Cirrus Logic Introduces Surround-Sound Codecs in 110dB, 114dB Range
2003_Jan-9: Vertical Integration an Advantage, Hitachi Pres. Says Upon Launch of New HDD Company
2003_Jan-9: Rambus Collaborates With Sony, Toshiba on Next-Generation Interfaces
2003_Jan-9: Philips, General Atomics Join to Develop Ultra-Wideband Chipsets
2003_Jan-9: Mitsubishi Heavy to Ship Test Home-Use Fuel Cells
2003_Jan-9: RFMD Announces Shipments of Front End Receiver to Japanese Handset Maker
2003_Jan-9: Cadence, Agere Launch Platform for High-Accuracy Layout Parasitic Extraction
2003_Jan-8: Telecom Industry: In 2003, Will People Stop Thinking 'Telephone' is Synonymous With 'NTT'?
2003_Jan-8: ITU, Inmarsat to Provide Satellite Services for Disaster Management
2003_Jan-8: Samsung Economic Research Institute Expects Korea's 2003 Growth Rate to be Under 5 Pct.
2003_Jan-8: Cell Phone Ad Market Doubles to 5 Billion Yen in '02
2003_Jan-8: BOC Edwards, MIS to Commercialize Supercritical CO2 Process Technology
2003_Jan-8: Dual-Slot PC Card Interface Switch Increases Power Efficiency
2003_Jan-7: Elpida Inks Outsourcing Deal with Chinese Semiconductor Firm
2003_Jan-7: Intel Poised to Enter DRAM Microchip Market Again
2003_Jan-7: TI Launches Nanopower Comparator in SOT23 for Low-Voltage Applications
2003_Jan-7: SynQor Introduces NiQor Non-Isolated SIP DC/DC Converters
2003_Jan-7: LG Group to Boost R&D; Spending in 2003
2003_Jan-6: Sharp to Advance Opening of Large Flat-Screen TV Plant
2003_Jan-6: Microchip Holds Design Contest at Tsinghua University in Beijing
2003_Jan-6: TI Unveils Gigabit Ethernet Transceiver with Low Power Consumption
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Nikkei Business Publications, Inc. All Rights Reserved.
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