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Daily News

2003_Sep-30: Epson, Renesas to Co-Develop Standard for Mobile Graphics High-Speed Interface
2003_Sep-30: Analog Devices Develops Low Noise, Low Distortion High-Speed OP Amp
2003_Sep-30: Microsoft Ties Up with TRON Group, Aims at Networked Home Appliances Market
2003_Sep-30: NetSilicon Japan Introduces ARM9 Based MCU with Ethernet MAC for Office Imaging Equipment
2003_Sep-30: Sharp Creates Audio Circuitry on LCD Panel Using ‘CG Silicon’ Technology
2003_Sep-30: EDA Industry Reports Positive Revenue Growth for Q2 2003
2003_Sep-30: Sanyo Electric to Offer LCD, Terrestrial Digital TVs Abroad
2003_Sep-30: International Rectifier Introduces New Application-Specific Diodes
2003_Sep-29: Sanyo Subsidiary Develops Discs Made from Corn
2003_Sep-29: Motorola, Nintendo Join Forces for Wireless Portable Gaming Device
2003_Sep-29: Samsung Electronics to Build Digital Media Research Center
2003_Sep-29: SKC to Mass-Produce Lithium Ion Polymer Batteries
2003_Sep-29: Murata Ships World’s First Chip Multilayer Ceramic PTC Thermistor
2003_Sep-29: Sharp Develops LCD Panel Speaker in Cooperation with Hosiden
2003_Sep-29: Maxon Wins US$15 Million Handset Order from Thailand
2003_Sep-29: KDDI, Others Obtain Certification from Infrared Data Assn
2003_Sep-29: Philips’ Two-Chip Solutions Deliver High Throughput for WLAN Applications
2003_Sep-29: Tundra, Motorola Join to Develop Next-Generation PowerPC Host Bridge Technology
2003_Sep-28: SCE, Nintendo, Others Tout Online Games at Tokyo Game Show
2003_Sep-26: Chinese Maker GS Magicdrive to Enter Market for 1.8-inch HDDs
2003_Sep-26: Kyocera Announces Industry’s Smallest SAW Filter for CDMA Handsets
2003_Sep-26: SMK Debuts Industry’s First Upper Contact, 0.3mm Spacing FPC Connector for Mobile Appliances
2003_Sep-26: Hamamatsu Photonics Develops Fast-Processing Robot Eye
2003_Sep-26: LG Holds World’s Largest PDP Production Capacity
2003_Sep-26: Shanghai to Grant Foreign Firms Intl Trade Rights By Year-End: Vice Mayor
2003_Sep-25: [WPC] Casio to Forecast Enabling Technologies Over Next Decade of Fuel Cells for Mobile Devices
2003_Sep-25: NTT to Join Efforts to Develop Linux for Telecom Use
2003_Sep-25: LG.Philips LCD Steps Up as World’s Biggest Supplier of LCDs for TVs
2003_Sep-25: Japan’s Electronic Industry Expected to Show More-Than-Expected Growth in 2003: JEITA
2003_Sep-25: Samsung to Sell Optical Disc Drive Operation to Toshiba
2003_Sep-25: LG Electronics Enjoys 1.55 Trillion Won Worth of Sales During August
2003_Sep-25: Anadigics Opens New Application Center in Taiwan
2003_Sep-25: NS Introduces LVDS SerDes to Simplify Design of Communications Systems
2003_Sep-24: Toshiba, Samsung to Integrate Optical Disk Device Businesses
2003_Sep-24: Avaya to Bring IP Wireless Phones to Japan
2003_Sep-24: [WPC] Toshiba Develops LCD with 229ppi VGA Resolution
2003_Sep-24: NEC Electronics Ships the World’s First 10-Bit LCD Source Driver IC
2003_Sep-24: Samsung SDS to Receive US$5 Million Investment from British Telecom
2003_Sep-24: SiGe Semiconductor Delivers New Power Amp for Wi-Fi Systems
2003_Sep-24: IMEC Design Methodology Provides Substrate-Noise Modeling, Analysis
2003_Sep-23: Computex Taipei Opens with Record 1,241 Exhibitors
2003_Sep-23: Sanyo Electric Launches Home-Use LCD Projector for Wall Mounting
2003_Sep-23: Green Hills Software Announces RTOS Support for Intel Network Processors
2003_Sep-23: NCsoft to Begin Paid Service of Lineage II in October
2003_Sep-23: Barcelona Design to Provide Synthesizable PLL Circuits for Toshiba’s SoC
2003_Sep-22: [WPC] NEC Notebook PC Prototype is Equipped with Fuel-Cell Battery
2003_Sep-22: [WPC] JATE-Certified Tiny AirH” Module to Debut; Certification Process to be Eliminated
2003_Sep-22: Sony, Samsung Electronics in Talks for Joint LCD Output
2003_Sep-22: Sony Marketing, Toppan Tie Up on Online Content Delivery for PDAs
2003_Sep-22: Korean Handset Makers Pay Substantial Royalties to CDMA Inventor Qualcomm
2003_Sep-22: TV Makers Enjoy Rising Revenues from PDP TVs
2003_Sep-22: Motorola Unveils Multimedia Processor for Communications Devices
2003_Sep-22: IDT Enters PC Clock Market with New Devices for Desktop Computers
2003_Sep-22: Atmel Unveils Flash Microcontroller Family with On-Chip Debug Capability
2003_Sep-19: [WPC] DoCoMo FOMA Phones to Offer International Video Phone
2003_Sep-19: Huawei and Infineon Work Together in China’s W-CDMA Market with Low-End Handsets
2003_Sep-19: Infineon Opens New Chinese Headquarters in Shanghai
2003_Sep-19: Ricoh Develops Rewritable Sheet with Embedded RFID Tag
2003_Sep-19: G.I.T.-Japan Becomes First Japanese Maker to Give Public Ultra Wideband Demo
2003_Sep-19: SK Telecom, Alcatel Join Hands for Mobile Commerce
2003_Sep-19: [WPC] DDI Pocket Showcases Handset for CF AirH” Card
2003_Sep-19: Korean Shares Rise for Second Day
2003_Sep-18: Dai Nippon Printing Releases Heat-Resistant ID Tags
2003_Sep-18: Toyota to Promote IC Cards by Using Mobile Phones, Electronic Toll Collection
2003_Sep-18: IT BUSINESS: Spread of Digital Devices Leads Chip Recovery
2003_Sep-18: NS, Zhejiang University Open Joint Analog, Mixed-Signal IC Laboratory
2003_Sep-18: Korea Leads in Global Broadband Subscribers, Says ITU
2003_Sep-17: ANALYSIS: Toshiba Struggles to Maintain Notebook PC Ops
2003_Sep-17: IC Tags on Display at Fifth Auto-ID Expo in Tokyo
2003_Sep-17: Matsushita Semiconductor Singapore to Start CCD Production
2003_Sep-17: Korea Ranks as World’s Top Broadband Nation, ITU Says
2003_Sep-17: Philips’ DOC Reference Design Enables Migration from CRT to Mid-End LCD TV
2003_Sep-17: Linear’s Direct Conversion Quadrature Demodulators Simplify RF Receivers Design
2003_Sep-17: Samsung Shares Lead Kospi Losses
2003_Sep-16: Mitsubishi Motors to Adopt Toyota Motor’s ‘G-BOOK’ from 2005
2003_Sep-16: IEEE to Standardize Baseline for More Secure Operating Systems
2003_Sep-16: E-Book Business Consortium to be Established in October
2003_Sep-16: Toshiba Selects Keithley’s Semiconductor Test System for 65nm CMOS Process Wafers
2003_Sep-16: Sony to Disclose Video-Recording Method for Memory Stick
2003_Sep-16: Micronas, Cabot Pre-Integrate MHEG-5 for Digital TV Market in UK
2003_Sep-16: KLA-Tencor Launches New Metal Films Metrology Tool
2003_Sep-15: Sony to Promote Application for Carrying Movies on Mobile Terminals
2003_Sep-15: PHS Manufacturers Eye China as Domestic Market Matures
2003_Sep-15: Solomon Systech Opens New Office in Shanghai
2003_Sep-15: China Mobile, Motorola Team Up to Expand GSM Services
2003_Sep-14: ANALYSIS: Au Cell Phone Music Proves Popular despite High Price
2003_Sep-13: Videophone Cartridge Developed for Game Boy Advance
2003_Sep-12: NEC Establishes Laboratories in China to Try Again with 3G Mobile Business
2003_Sep-12: Hitachi, Renesas Technology Develop IC to Read ‘Mu-Chip’
2003_Sep-12: Matsushita to Debut SD Card-based Multi-functional Camera/Camcorders
2003_Sep-12: Renesas Releases One-Chip LCD Driver for Two-Screen Mobile Phone Supporting QCIF+
2003_Sep-12: Matsushita Electric Works Focuses on New MEMS Device Development
2003_Sep-12: Sony Accelerates RTL Timing Design of SoC with InTime’s EDA Software
2003_Sep-12: INTERVIEW: Rakuten to Launch Net Business Models in China via Mytrip
2003_Sep-12: Alcatel Wins DSL Expansion Project in Vietnam
2003_Sep-12: National Semiconductor Launches Dual 5A Gate Drivers
2003_Sep-11: Younger People Feel Less Guilty of ‘Digital Shoplifting’: Survey
2003_Sep-11: Broadband Subscribers Reach 11 Million in Japan, FTTH Subscribers Grow
2003_Sep-11: NEC Electronics Selects Synopsys’ Star-RCXT for 90-Nanometer, Cell-Based IC Design
2003_Sep-11: Epson’s Microcomputer Provides Simplified Chinese Characters on Mobile Displays
2003_Sep-11: Toshiba Completes 2.5MGate SoC Design in Four Weeks with Magma’s EDA Tools
2003_Sep-11: YEN & YUAN: Japanese Firms Scramble to Land Chinese IT Engineers
2003_Sep-11: Linear’s LED Multi-Display Driver Features Digital Control
2003_Sep-10: Hitachi Develops Generator That Can Output 0.12 uW from Tiny Vibrations of Buildings
2003_Sep-10: Renesas Technology Reveals ‘Greater China Project’
2003_Sep-10: Samsung Electronics Begins Mass Production of 576Mb Rambus DRAM
2003_Sep-10: Au’s Subscribers Outpace DoCoMo with Monthly Increase of 200,000
2003_Sep-10: Sipec to Provide Chip Technology Services to China’s CSMC
2003_Sep-10: Osram’s LEDs Offer Improved Homogeneity, Brightness
2003_Sep-10: FCI Unveils Shieldless High-Speed Connector
2003_Sep-9: Mitsubishi Electric Develops New Optical Fingerprint Sensor
2003_Sep-9: Renesas Technology Unveils World’s Smallest 16Mb SRAM Chip
2003_Sep-9: Intel Capital Invests in Lithium Polymer Battery Developer in Japan
2003_Sep-9: Number of Korean Firms on Top Global 500 Rises to Pre-Crisis Level
2003_Sep-9: Frequency Shortage Poses Big Problem for Wireless Telecom
2003_Sep-9: SMIC to Utilize STATS’ Wafer Probe Services in Shanghai
2003_Sep-9: RFMD Announces Customer Qualification of Six-Inch Wafer Manufacturing Capacity
2003_Sep-8: NEC Interchannel to Launch Business Providing Mobile Phone Contents in China
2003_Sep-8: Sharp to Beef Up to Develop Recycling Technologies for LCD Products
2003_Sep-8: Hitachi Develops Wireless LAN-Based Positioning System for Release in October
2003_Sep-8: Samsung Electronics Takes 9.9% of World Wireless Handset Market
2003_Sep-8: Matsushita to Build R&D; Facility in Malaysia’s Multimedia Super Corridor
2003_Sep-8: Sony to Sell Memory Stick TV Recording Gear
2003_Sep-8: Philips Introduces SoC Solution for Hybrid LCD, Digital TVs
2003_Sep-8: KLA-Tencor, Carl Zeiss Form Alliance on Next-Generation Photomasks
2003_Sep-7: Hitachi Maxell Develops Miniature Lithium Ion Battery
2003_Sep-6: Sony to Start Internet Music Services in US, Europe
2003_Sep-5: Pioneer’s New DVD Recorders Achieve 24x, High-Speed Dubbing
2003_Sep-5: Samsung Electronics to Market Video Camera with HDD in December
2003_Sep-5: Sony Gets Aggressive with Digital Terrestrial Broadcasting-Compliant TV
2003_Sep-5: Global Semiconductor Sales Rise 10.5% in July, SIA Says
2003_Sep-5: Huawei, Siemens to Form Joint Venture for TD-SCDMA Mobile Communications
2003_Sep-5: Compuware Becomes Testing Partner for Beijing’s Zhongguancun Software Park
2003_Sep-5: Samsung Electronics Develops World’s Smallest 1Gb DRAM
2003_Sep-5: Linear’s Step-Down Switching Regulator Has Only 100micro-A Quiescent Current
2003_Sep-5: Producer Prices in Korea Up for Third Straight Month in August
2003_Sep-5: ANALYSIS: Toshiba Builds Ultra-Efficient Notebook PC Plant in China
2003_Sep-4: China’s Notebook PC Production Rose Sharply in 2002: Fuji-Keizai Survey
2003_Sep-4: Toshiba Licenses ARM10 CPU Core for Custom SoC Business
2003_Sep-4: China Continues Lead in AP Server Revenue, Says Gartner
2003_Sep-4: Sanyo, ST Join to Develop Digital TV Technology
2003_Sep-4: Hynix Moves to Heighten Competitiveness in Mobile Application Chip Biz
2003_Sep-4: Sharp Technology Can Control Mite-Related Allergies
2003_Sep-3: Hitachi Develops RFID Mu-Chip with Embedded Antenna
2003_Sep-3: Cadence and Design House in Shanghai Establish Design Flow for CSMC’s 0.5-Micron Process
2003_Sep-3: Car Navigation Systems, Image Processing Gear Performed Well in July, JEITA Says
2003_Sep-3: Intel Plans to Establish R&D; Center in Korea This Year
2003_Sep-3: Olympus Verifies SoCs for Next-Generation Digital Camera with Axis’ Emulator
2003_Sep-3: Taito, Nokia to Join Hands on Cell Phone Karaoke
2003_Sep-3: Vishay Introduces New Thin Film Power Resistor Series
2003_Sep-3: IR Partners with RS Components for Distribution in Asia
2003_Sep-3: Hanaro Telecom to Attract Foreign Capital in Effort to Stay Afloat
2003_Sep-2: Toshiba Tec Develops System to Manage Commodities With Coin-Sized Tag
2003_Sep-2: Seiko Epson Develops New Material for FeRAM
2003_Sep-2: JR East, Japan Telecom to Test Distribute Moving Images in Train Coach
2003_Sep-2: Sharp Develops Smallest CCD 1.1 Megapixel Camera Module for Mobile Phones, PDAs
2003_Sep-2: Canon to Debut 1st Product to Meet EU’s Eco-Friendly Rules
2003_Sep-2: Dallas’ Real-Time Clock Offers Software Clock Calibration
2003_Sep-2: LG.Philips LCD to Invest US$2.6 Bln for Next-Generation Facilities
2003_Sep-2: LG Group to Nurture ABS, Digital TVs and Home Shopping as Key Businesses
2003_Sep-1: NEC Group Installs IP Phone System Using Wireless LAN/PHS, in Osaka Hotel
2003_Sep-1: Korea’s Electronics Biz on the Verge of Surpassing Japan’s: Maeil Business
2003_Sep-1: Victor Japan Develops LCOS Device for High-Resolution Projectors for HDTV, 4K2K Panels
2003_Sep-1: Intel to Build Assembly and Testing Facility in Western China
2003_Sep-1: Japan, China, Korea to Jointly Develop Windows Replacement OS
2003_Sep-1: Murata Ships Smallest 2GHz Band Isolator for Mobile Phones
2003_Sep-1: Alcatel Invests Heavily in China’s 3G Development
2003_Sep-1: Samsung Electronics Launches High-Speed DRAM for Game Consoles
2003_Sep-1: Samsung Electro-Mechanics Develops New Module for Wireless Handsets


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2004: January February March April May June July August September

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