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  • Fujitsu Wins U.S. Patent for IC BGA-Package Technology
  • March 18, 1999 (TOKYO) — Fujitsu Ltd. and its subsidiary Fujitsu Microelectronics Inc. of the United States said March 15 that the company has obtained a wide-ranging U.S. patent on ball grid array (BGA) technology.
    The patent covers a range of BGA-package-related know-how, such as BGA, chip size package (CSP) and multi-chip package (MCP) technology using wire bonding or flip-chip connections.

    Motorola Inc. was generally considered to have held a basic patent covering BGA technology. However, Fujitsu’s original data attached to the patent request is dated Sept. 22, 1980, or about ten years earlier than Motorola’s request. The registration number is 5861670, a Fujitsu official said.

    (Nikkei Microdevices)



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