(Nikkei BP Group)
(No.1 High-Tech News Site in Japanese)
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| Selete Pushes Evaluation of 300mm Wafer Transport System
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December 8, 1998 (TOKYO) -- Semiconductor Leading Edge Technologies Inc.
(Selete) said it is promoting the evaluation of an automatic transportation
system for a 300mm wafer.
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Selete is an institute for jointly developing semiconductor manufacturing
equipment using a 300mm wafer.
Selete
reported that at the 4th Selete 300mm Program Evaluation Progress Announcement
held in Tokyo on Dec. 1 that evaluation measures can prevent specifications
of transporting equipment from differing.
Evaluation measures will be implemented in January 1999. The simulation
was already made.
Evaluation is to be made on an automatic guided vehicle (AGV), an overhead
track system, a stocker, and other systems components. It will be made
in two types, such as an open cassette and a clean box. Evaluated items
include transporting capacity, transporting precision and a particle's
effect.
An automatic transport system is indispensable in constructing lines
because the weight of a 300mm wafer lot is about 5kg in an open cassette
and about 8kg in a clean box.
Selete said mass production of a microchip using a 300mm wafer will ramp
up in the middle of 2000, so it plans to complete the evaluation by
March 2000.
Related story: Development of 300mm Wafer Tech Aims at Production
in 2000
(Nikkei
Microdevices)
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