•News Center
 •This Week
 •US Firms in Asia
 •Register Now
 •About Us
 •Advertising Info
 •Nikkei BP Group


Advanced Search

(Japanese Site)

  • NEC, Fujitsu to Produce 0.21-0.22 Micron DRAMs
  • January 26, 1998 (TOKYO) -- NEC Corp. and Fujitsu Ltd. announced plans to upgrade their microchip production lines, with both companies slated to start making DRAMs using 0.21-micron to 0.22- micron processes by the end of this year.

    NEC will begin producing microchips using a 0.22-micron design rule later this year. That design rule reduces the area of a 64Mb DRAM to just over 50 sq. mm.

    The new processing technology will result in a 256Mb DRAM with an area of 160 sq. mm, which will extend the application of 200mm wafers instead of moving to the next-generation 300mm wafers.

    NEC decided to postpone starting its pilot line using 300mm wafers for a year, because of the prospects for significant cost reductions under the new design rule.

    Fujitsu said it will start producing DRAMs using 0.21-micron or 0.22-micron process technology in late 1998. It now makes DRAMs with 0.32-micron technology.

    Although Fujitsu has developed 0.28-micron design-rule microchips, it will skip that stage and instead produce commercial chips at the 0.21-micron to 0.22-micron level. This is in response to moves by its competitors to apply the latest technology. Fujitsu's new products will be 100MHz synchronous DRAMs measuring 51 sq. mm.

    (Nikkei Microdevices)

    Copyright © 1997-98
    Nikkei BP BizTech, Inc.
    All Rights Reserved.
    Updated: Sun Jan 25 00:13:57 1998