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  • Toshiba to Use Dense-Pac Stacking Technology for Memories
  • July 16, 1998 (BOSTON) -- Toshiba America Electronic Components signed a manufacturing agreement to make stacking products developed by Dense-Pac Microsystems Inc. of California.
    Toshiba America Electronic, a semiconductor division of Japan's Toshiba Corp., will use Dense-Pac's proprietary stacking technology in various Toshiba high-density memory solutions.

    Dan Jakle, Dense-Pac's vice president of OEM sales at Dense-Pac, which is located in Garden Grove, Calif., said the agreement came after months of testing of Dense-Pac's stacking technology domestically and in Japan.

    "We have automated the process of stacking memory devices. This creates a very efficient method in handling large-volume orders," Jakle said.

    "While at this time we do not know the magnitude of the revenue to be generated by this agreement, we expect it to be a very successful venture for both companies," he said. "This represents a major step for Dense-Pac in our commercial application of our stacking technology."

    Toshiba America Electronic Components is the North America engineering, manufacturing, sales and marketing of Toshiba Corp., one of the world's largest suppliers of semiconductors, integrated circuits and electronic components for industrial and consumer applications. The company is a leader in CMOS technology and has one of the broadest IC lines in the industry. Toshiba is also a high-end provider of memory and a technology leader in memory products.

    Dense-Pac is a technology company that specializes in the design of proprietary and patented three-dimensional high-density memory products, Internet commerce solutions, printer media devices, custom memory subsystems and development software for OEM manufacturers of laser printers and electronic forms.

    The proprietary stacking technology, which is patented, lets very large amounts of memory be used in computer and electronic systems with no increase in board size, the company said. The technology allows for significant reductions in integrated circuit board space, weight and cost.

    More information is at: www.toshiba.com and www.dense-pac.com.

    (Lori Valigra, Asia BizTech Correspondent)

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    Updated: Wed Jul 15 17:31:07 1998