(Nikkei BP Group)
(No.1 High Tech News Site in Japan)
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| Toshiba to Use Dense-Pac Stacking Technology for Memories
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July 16, 1998 (BOSTON) -- Toshiba America Electronic Components signed
a manufacturing agreement to make stacking products developed by Dense-Pac
Microsystems Inc. of California.
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Toshiba America Electronic, a semiconductor division of Japan's Toshiba
Corp., will use Dense-Pac's proprietary stacking technology in various
Toshiba high-density memory solutions.
Dan Jakle, Dense-Pac's vice president of OEM sales at Dense-Pac, which
is located in Garden Grove, Calif., said the agreement came after months
of testing of Dense-Pac's stacking technology domestically and in Japan.
"We have automated the process of stacking memory devices. This creates
a very efficient method in handling large-volume orders," Jakle said.
"While at this time we do not know the magnitude of the revenue to be
generated by this agreement, we expect it to be a very successful venture
for both companies," he said. "This represents a major step for Dense-Pac
in our commercial application of our stacking technology."
Toshiba America Electronic Components is the North America engineering,
manufacturing, sales and marketing of Toshiba Corp., one of the world's
largest suppliers of semiconductors, integrated circuits and electronic
components for industrial and consumer applications. The company is
a leader in CMOS technology and has one of the broadest IC lines in
the industry. Toshiba is also a high-end provider of memory and a technology
leader in memory products.
Dense-Pac is a technology company that specializes in the design of proprietary
and patented three-dimensional high-density memory products, Internet
commerce solutions, printer media devices, custom memory subsystems
and development software for OEM manufacturers of laser printers and
electronic forms.
The proprietary stacking technology, which is patented, lets very large
amounts of memory be used in computer and electronic systems with no
increase in board size, the company said. The technology allows for
significant reductions in integrated circuit board space, weight and
cost.
More information is at: www.toshiba.com
and www.dense-pac.com.
(Lori Valigra, Asia BizTech Correspondent)
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