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  • Development of 300mm Wafer Tech Aims at Production in 2000
  • October 15, 1998 (TOKYO) -- Japan's Semiconductor Leading Edge Technologies Inc. (Selete) and the International 300mm Initiative of the United States, both of which are groups that seek to develop 300mm wafers, disclosed details of their wafer technologies.
    The two groups presented lectures at the "300mm Fab Design and Automation" session of the 7th International Symposium on Semiconductor Manufacturing (ISSM '98). The symposium centers on manufacturing technologies for integrated circuits.

    Hiroyoshi Komiya, executive vice-president of Selete, said that technological development of 300mm wafers and the 0.18-micron design rule must be accelerated. Komiya said that he expects production using 300mm wafers to start in mid 2000.

    Also, he stated that industry-wide cooperation is required to effectively promote speedy development. Without such collaboration, isolated bottlenecks could hamper overall progress, resulting in delays.

    Frank Robertson, general manager of International 300mm Initiative, said that mass production using 300mm wafers will be launched in the latter half of 2000. The consortium estimates growth rates in the IC industry at 5 percent-11 percent in 1999, 18 percent-23 percent in 2000 and 22 percent-31 percent in 2001. Robertson said the estimates are based on the projected growth rates and the results of hearings that the consortium has conducted.

    Also, it is expected that manufacturing plants in 2001 will use five lines of monthly production of 20,000 wafers, 12 lines in 2002 and 16 lines in 2003. As a result, it is projected that most manufacturing equipment using up-to-date technologies will comply with 300mm standards by 2003.

    (Nikkei Microdevices)


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    Updated: Wed Oct 14 17:32:45 1998 PDT