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2003_Dec-31: Japanese School Girls Prefer Cell Phone with Camera
2003_Dec-31: IEEE Spectrum to Host Emerging Technologies Panels at Upcoming Consumer Electronics Show
2003_Dec-31: Digital Appliance Boom Boosts Chip, Electronic Parts Markets
2003_Dec-30: World Digital Camera Shipments Top 1 Trillion Yen in Jan-Nov Period
2003_Dec-29: NTT DoCoMo to Provide Funds to FOMA Developers
2003_Dec-29: FLAT PANEL: Display Panels in Short Supply Despite Output Expansion
2003_Dec-26: Anritsu, China Univ Tie Up on 3G Cell Phone Devices
2003_Dec-26: Telson Electronics Wins US$11 Million Order from Venezuela
2003_Dec-24: China's TechFaith, NEC Establish Joint Venture for the Design and Development of 3G Handset
2003_Dec-24: Sharp's ARM-Based MCUs Applied to Fisher Price's Electronic Toys
2003_Dec-24: Elpida Halts Negotiations with ProMOS
2003_Dec-24: Japanese Firms to Set Standards for LED-Based Lighting
2003_Dec-23: NTT DoCoMo, 27 Others to Test Services Using Mobile Phone with Non-Contact Card
2003_Dec-22: Hutchison 3G HK to Start 3G Mobile Phone Service in Hong Kong from January
2003_Dec-22: Countdown to Flat Rate Plans for Mobile Communication Begins
2003_Dec-21: DoCoMo to Defray Some Costs for 3G FOMA Handset Developers
2003_Dec-19: Mitsubishi, Sanyo, Sharp, Toshiba Tie Up for Home Networking Technology
2003_Dec-19: NEC Acquires Beijing Design Company, Beijing Hua Hong NEC IC Design
2003_Dec-19: Korea Plans to Auction 4G Mobile Licenses in 2004
2003_Dec-18: Ripplewood Holdings Mulls Entry into 3G Mobile Services in Japan
2003_Dec-18: Samsung to Invest Additional 628.8 Billion Won in Chip Biz
2003_Dec-18: Achilles to Triple Hard-Disk Coating Capacity in China
2003_Dec-18: I-Mode Brand Lacks Punch in Europe: Sony Ericsson Director
2003_Dec-17: Enterprises Introduce IP Phone System to Reduce Cost: IP Telephony Survey
2003_Dec-17: Major European Distribution Firms Begin Tests of Wireless Tag System
2003_Dec-17: Taiwan's Far EasTone, Yuan-Ze to Deploy Ericsson's W-CDMA Network
2003_Dec-17: Disney, Microsoft, Sanyo to Be Key Members of DVD Forum
2003_Dec-16: Chinese Experts Analyze China Business
2003_Dec-16: Online Game Developers are Fastest Growing in A/P: Deloitte Touche Tomatsu Ranking
2003_Dec-16: NEW MATERIALS: Suppliers Compete with New LCD Technologies
2003_Dec-15: Korea's Chip, Electronics Exports to Rise, Textile, Construction Exports to Fall in 2004
2003_Dec-15: Battles Emerge in Large-Size Panels, Small to Mid-Size Panels
2003_Dec-14: Sanyo to Boost Digital Camera Output Capacity 74% in FY04
2003_Dec-13: Fruits of Windows-TRON Alliance Could Hit Market in 2004
2003_Dec-12: EAccess to Join TD-CDMA 3G Services
2003_Dec-12: KDDI to Use Sony Smart Card Tech for Its 3G Cell Phones
2003_Dec-12: DongbuAnam Semiconductor Warns of Supply Shortage in Foundry Market
2003_Dec-12: Samsung to Move Microwave Factory Abroad
2003_Dec-12: Desktop HDDs to be Serial ATA by End of 2004: Seagate Technology VP
2003_Dec-11: Matsushita Expands Plasma TV Production in Shanghai
2003_Dec-11: Fujitsu Labs Makes Prototype of High-Output Power GaN HEMT Amplifier for 3G Mobile Networks
2003_Dec-11: Matsushita to Elevate Standards for Chinese Procurement
2003_Dec-11: Alcatel Announces US$40 Million Mobile Contracts from China Unicom
2003_Dec-10: LG.Philips Exceeds 10 Million Units in 2003 Sales of LCD Monitors
2003_Dec-10: Samsung Electronics Enjoys Increased Demand for Wireless Handsets
2003_Dec-10: DoCoMo to Invest in Fund Targeting Chinese Venture Firms
2003_Dec-9: Mega-Pixel Camera Phone Users to Spend More Money: MRI Survey
2003_Dec-9: Samsung Electronics Retains Top Post in Memory Chip Market
2003_Dec-9: FOCUS: Japan Flat-Panel Makers Must Compete on Superior Technology
2003_Dec-8: Fujitsu to Open Green Procurement Bases in Taiwan, China
2003_Dec-8: Chip Equipment Sales to Rise 38% in 2003
2003_Dec-8: Mobile Phones Continue to Advance as Business Stations
2003_Dec-7: Renesas Emerges as World 3rd Largest Semiconductor Maker
2003_Dec-6: SEMICONDUCTOR: Govt to Revamp Public/Private Chip Projects for Quick Standardization
2003_Dec-5: Toshiba, SanDisk to Expand NAND Flash EEPROM Output with 300-mm Wafer Line
2003_Dec-5: Matsushita's Production Capacity of Semiconductor Encapsulation Materials in Shanghai to be Tripled
2003_Dec-5: Zenrin to Go After Car Navigation Business in China
2003_Dec-4: ANALYSIS: Market for Flat TVs Heats Up with Canon's Entry
2003_Dec-4: Vodafone Group Strategy Director Says 3G is Just Another Technology, Not Like Service that Counts
2003_Dec-3: Global Semiconductor Sales Achieve 23.3% YOY Growth in October
2003_Dec-3: Sharp to Initiate On-Going Campaign to Hire New Graduates in China
2003_Dec-2: Terrestrial Digital TV Broadcasting Launched in Japan
2003_Dec-2: Visible Light Communications Consortium Established
2003_Dec-2: LED EVOLUTION: New Alliances See Bright Future for White LEDs
2003_Dec-1: Samsung Develops LCD for 57-Inch TV
2003_Dec-1: Sony to Separate Part of a Business for FeliCa Joint Venture with NTT DoCoMo
2003_Dec-1: Samsung Joins Hands with Telecom Italia to Boost Prospects in Europe
2003_Dec-1: Nanotech Products Just Years Away, 2 Trillion Yen Market Seen by '05
2003_Dec-1: Vodafone KK of Japan Striving to Recover from Setback


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