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2003_Sep-30: EDA Industry Reports Positive Revenue Growth for Q2 2003
2003_Sep-30: International Rectifier Introduces New Application-Specific Diodes
2003_Sep-29: Philips’ Two-Chip Solutions Deliver High Throughput for WLAN Applications
2003_Sep-29: Tundra, Motorola Join to Develop Next-Generation PowerPC Host Bridge Technology
2003_Sep-25: Anadigics Opens New Application Center in Taiwan
2003_Sep-25: NS Introduces LVDS SerDes to Simplify Design of Communications Systems
2003_Sep-24: SiGe Semiconductor Delivers New Power Amp for Wi-Fi Systems
2003_Sep-24: IMEC Design Methodology Provides Substrate-Noise Modeling, Analysis
2003_Sep-23: Green Hills Software Announces RTOS Support for Intel Network Processors
2003_Sep-23: Barcelona Design to Provide Synthesizable PLL Circuits for Toshiba’s SoC
2003_Sep-22: Motorola Unveils Multimedia Processor for Communications Devices
2003_Sep-22: IDT Enters PC Clock Market with New Devices for Desktop Computers
2003_Sep-22: Atmel Unveils Flash Microcontroller Family with On-Chip Debug Capability
2003_Sep-19: Infineon Opens New Chinese Headquarters in Shanghai
2003_Sep-18: NS, Zhejiang University Open Joint Analog, Mixed-Signal IC Laboratory
2003_Sep-18: Korea Leads in Global Broadband Subscribers, Says ITU
2003_Sep-17: Philips’ DOC Reference Design Enables Migration from CRT to Mid-End LCD TV
2003_Sep-17: Linear’s Direct Conversion Quadrature Demodulators Simplify RF Receivers Design
2003_Sep-16: Micronas, Cabot Pre-Integrate MHEG-5 for Digital TV Market in UK
2003_Sep-16: KLA-Tencor Launches New Metal Films Metrology Tool
2003_Sep-15: Solomon Systech Opens New Office in Shanghai
2003_Sep-15: China Mobile, Motorola Team Up to Expand GSM Services
2003_Sep-12: Alcatel Wins DSL Expansion Project in Vietnam
2003_Sep-12: National Semiconductor Launches Dual 5A Gate Drivers
2003_Sep-11: Epson’s Microcomputer Provides Simplified Chinese Characters on Mobile Displays
2003_Sep-11: Linear’s LED Multi-Display Driver Features Digital Control
2003_Sep-10: Osram’s LEDs Offer Improved Homogeneity, Brightness
2003_Sep-10: FCI Unveils Shieldless High-Speed Connector
2003_Sep-9: SMIC to Utilize STATS’ Wafer Probe Services in Shanghai
2003_Sep-9: RFMD Announces Customer Qualification of Six-Inch Wafer Manufacturing Capacity
2003_Sep-8: Philips Introduces SoC Solution for Hybrid LCD, Digital TVs
2003_Sep-8: KLA-Tencor, Carl Zeiss Form Alliance on Next-Generation Photomasks
2003_Sep-5: Compuware Becomes Testing Partner for Beijing’s Zhongguancun Software Park
2003_Sep-5: Linear’s Step-Down Switching Regulator Has Only 100micro-A Quiescent Current
2003_Sep-4: China Continues Lead in AP Server Revenue, Says Gartner
2003_Sep-4: Sanyo, ST Join to Develop Digital TV Technology
2003_Sep-3: Vishay Introduces New Thin Film Power Resistor Series
2003_Sep-3: IR Partners with RS Components for Distribution in Asia
2003_Sep-2: Seiko Epson Develops New Material for FeRAM
2003_Sep-2: Dallas’ Real-Time Clock Offers Software Clock Calibration
2003_Sep-1: Intel to Build Assembly and Testing Facility in Western China
2003_Sep-1: Alcatel Invests Heavily in China’s 3G Development


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