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2003_Dec-31: Global DVD Recorder Output Soars 400% to 3.7 Million Units in 2003
2003_Dec-31: IEEE Spectrum to Host Emerging Technologies Panels at Upcoming Consumer Electronics Show
2003_Dec-31: [World DRAM Prices] Spot Prices Keep Declining in First Two Weeks of December
2003_Dec-31: Digital Appliance Boom Boosts Chip, Electronic Parts Markets
2003_Dec-30: Philips' System Chip Offers Multi-Standard Video Decoding Solution
2003_Dec-30: NS Launches 100V Active Clamp PWM Controller
2003_Dec-30: World Digital Camera Shipments Top 1 Trillion Yen in Jan-Nov Period
2003_Dec-29: NTT DoCoMo to Provide Funds to FOMA Developers
2003_Dec-29: Triple Point to Provide Technology for India's First Online Electricity Trading Exchange
2003_Dec-29: FLAT PANEL: Display Panels in Short Supply Despite Output Expansion
2003_Dec-29: Commercial Fuel Cells: On Eve of Commercial Deployment
2003_Dec-26: Fujitsu Develops Touch Panel Using Conductive Polymer Film
2003_Dec-26: Dell's New Power Adapter Can Recharge Certain Notebook PCs Anywhere
2003_Dec-26: Anritsu, China Univ Tie Up on 3G Cell Phone Devices
2003_Dec-24: Sony's QRIO Robot Uses Motor with Improved Torque
2003_Dec-24: LCD TVs Made by PC Producers to Account for 20% in 2004: Research Group Says
2003_Dec-24: [World DRAM Price] Spot Prices Drag Down Contract Prices
2003_Dec-24: Sharp's ARM-Based MCUs Applied to Fisher Price's Electronic Toys
2003_Dec-24: Elpida Halts Negotiations with ProMOS
2003_Dec-24: Japanese Firms to Set Standards for LED-Based Lighting
2003_Dec-24: Samsung Licenses Silicon Image SATA Core
2003_Dec-24: Infineon to Expand Testing Operations in Singapore through Tester Pooling
2003_Dec-23: PlayStation 2 Debut in China Postponed
2003_Dec-23: NTT DoCoMo, 27 Others to Test Services Using Mobile Phone with Non-Contact Card
2003_Dec-23: Japan's Electronic Industry Output to Expand in 2004, JEITA Says
2003_Dec-23: Shanghai Fudan Microelectronics Licenses ARM7TDMI for Consumer Electronics Chips
2003_Dec-22: Hutchison 3G HK to Start 3G Mobile Phone Service in Hong Kong from January
2003_Dec-22: NTT DoCoMo Unveils New 3G FOMA 900i Series Handsets
2003_Dec-22: Toshiba, Fujitsu Receive Certification on Bluetooth-Enabled Mobile Phones
2003_Dec-22: TI Introduces New Applications Processor for Wireless Industry
2003_Dec-22: Microchip Unveils Four 8-Bit MCUs to Enhance Power Management
2003_Dec-19: KDDI Unveils Cell Phones Compatible with Replaceable FeliCa IC Cards
2003_Dec-19: Mitsubishi, Sanyo, Sharp, Toshiba Tie Up for Home Networking Technology
2003_Dec-19: NEC Acquires Beijing Design Company, Beijing Hua Hong NEC IC Design
2003_Dec-19: Kodak Japan Demonstrates OLED Panel at Cinema Festival in Tokyo
2003_Dec-19: NEC Develops DVD Technology to Handle Current, New Standards
2003_Dec-19: UMC Introduces RFCMOS Design Methodology
2003_Dec-19: Intersil Unveils Fast Dual Mode MOSFET Driver for Multiphase Power Converters
2003_Dec-18: Toshiba Establishes a New Company in China to Coordinate Semiconductor Business
2003_Dec-18: Samsung to Invest Additional 628.8 Billion Won in Chip Biz
2003_Dec-18: NEC-Samsung Face Recognition Technology Selected for MPEG-7 Standard
2003_Dec-18: Toshiba's 'Postage Stamp-Sized' HDD to be Embedded in Mobile Devices
2003_Dec-18: Achilles to Triple Hard-Disk Coating Capacity in China
2003_Dec-18: ST Unveils PC BIOS Flash Chip Combining Firmware Hub, Low Pin Count Architectures
2003_Dec-18: Linear's Step-Down DC/DC Controller Consumes only 16micro-A
2003_Dec-18: I-Mode Brand Lacks Punch in Europe: Sony Ericsson Director
2003_Dec-17: Shinano Kenshi Develops New Material Made from Silk for Fuel Cell Electrodes
2003_Dec-17: Major European Distribution Firms Begin Tests of Wireless Tag System
2003_Dec-17: [World DRAM Price] PC Makers' Reduced Procurement Leads Price Fall for Contract Users
2003_Dec-17: Disney, Microsoft, Sanyo to Be Key Members of DVD Forum
2003_Dec-17: Micron Launches 2- and 3-Megapixel CMOS Image Sensors
2003_Dec-17: Hong Kong Opens Wireless Development Center
2003_Dec-16: Hitachi Adopts Cartridge Fuel Supply for Fuel Cells for Portable Applications
2003_Dec-16: NJRC Releases Audio Processor Chip with BBE, SRS for TVs
2003_Dec-16: NEW MATERIALS: Suppliers Compete with New LCD Technologies
2003_Dec-16: Zetex ICs Support Color LCD Backlighting
2003_Dec-16: ON Semiconductor Introduces Overvoltage Protection IC
2003_Dec-15: World's First Bone Conduction Cellular Phone to Debut
2003_Dec-15: STM, TI Developing 1xEV-DV Chipset
2003_Dec-15: Toshiba Creates World's Smallest Hard-Disk Drive
2003_Dec-15: Sharp, BitFlash Release System to Display Business Documents on Mobile Phones
2003_Dec-15: Renesas Technology Releases TFT Drivers for WXGA, WXGA+, and HDTV LCD TVs
2003_Dec-15: China Mobile Selects Alcatel's Optical Fiber for Backbone Project
2003_Dec-15: TI's Dual Supply Level Translation Transceivers Offer Full Bit Width Flexibility
2003_Dec-15: Battles Emerge in Large-Size Panels, Small to Mid-Size Panels
2003_Dec-14: Sanyo to Boost Digital Camera Output Capacity 74% in FY04
2003_Dec-12: Korea's Planet INT Introduces PLC System to Japan
2003_Dec-12: Toshiba, Denso Develop Multi-OS Environment for Car Navigation Systems
2003_Dec-12: AMD and Founder Group of Peking University Jointly Establish Information Appliance Development Lab in Beijing
2003_Dec-12: NS' New Bluetooth 1.2 Compliant Products Optimized for Mobile, PDA Apps
2003_Dec-12: KDDI to Use Sony Smart Card Tech for Its 3G Cell Phones
2003_Dec-12: DongbuAnam Semiconductor Warns of Supply Shortage in Foundry Market
2003_Dec-12: IMEC Announces High-k/Metal Gate Stacks to Remove Barriers to Sub-1nm
2003_Dec-12: Samsung to Move Microwave Factory Abroad
2003_Dec-11: Matsushita Expands Plasma TV Production in Shanghai
2003_Dec-11: E Ink, Philips Electronics Unveil Driving Schemes for Electronic Paper
2003_Dec-11: Fujitsu Labs Makes Prototype of High-Output Power GaN HEMT Amplifier for 3G Mobile Networks
2003_Dec-11: Analog Devices Enters Mid-/Low-End DSP Market with Third-Generation SHARC Processors
2003_Dec-11: VGA Panel with FS Technology Saves Two-Thirds of Power Consumption for LCD TVs
2003_Dec-11: Matsushita to Elevate Standards for Chinese Procurement
2003_Dec-11: Alcatel Announces US$40 Million Mobile Contracts from China Unicom
2003_Dec-11: Agilent Introduces 50MB/s to 40GB/s Jitter Subcomponent Analysis Capability
2003_Dec-10: Ubiquitous ID Center Incorporates Wireless Tag Reader/Writer in PHS
2003_Dec-10: LG.Philips Exceeds 10 Million Units in 2003 Sales of LCD Monitors
2003_Dec-10: Samsung Electronics Enjoys Increased Demand for Wireless Handsets
2003_Dec-10: Renesas Develops SOI CMOS Device Technology with New Structure
2003_Dec-10: Philip's New Chip to Make US$200 DVD Recorder a Reality
2003_Dec-10: Near Field Communication Technology of Sony, Philips Approved as ISO/IEC Standard
2003_Dec-10: NTT Communications Testing IP 3G Mobile Communication
2003_Dec-10: BivarOpto Unveils 180-Deg Viewing Angle LED Module for High Intensity Displays
2003_Dec-10: ST, TI Join to Develop New cdma2000 1X Solution
2003_Dec-10: [World DRAM Price] Prices for Large-Volume Users Fall Slightly
2003_Dec-9: NJRC Samples 500mA Adjustable Low Dropout Voltage Regulator for Digital Consumer Electronics
2003_Dec-9: Samsung Electronics Retains Top Post in Memory Chip Market
2003_Dec-9: SEZ Expands Single-Wafer Technology with New Substrate-Etch Tool
2003_Dec-9: ERNI Introduces New Angled D-Sub Pressfit Connectors
2003_Dec-9: FOCUS: Japan Flat-Panel Makers Must Compete on Superior Technology
2003_Dec-8: Hitachi to Sell Low-Cost and Small Mu-Chip Inlets
2003_Dec-8: Nissin Electric Releases Power-Generating Module
2003_Dec-8: Fujitsu to Open Green Procurement Bases in Taiwan, China
2003_Dec-8: Futaba, Trinamic Develop Transformerless Smart VFD Power Supply IC
2003_Dec-8: Soitec, Seika Form Asian JV on SOI Technology, Services
2003_Dec-8: Chip Equipment Sales to Rise 38% in 2003
2003_Dec-7: Renesas Emerges as World 3rd Largest Semiconductor Maker
2003_Dec-6: SEMICONDUCTOR: Govt to Revamp Public/Private Chip Projects for Quick Standardization
2003_Dec-5: NTT DoCoMo to Launch Handset Compatible with FOMA, Wireless LAN to Expand Customer Base
2003_Dec-5: Toshiba, SanDisk to Expand NAND Flash EEPROM Output with 300-mm Wafer Line
2003_Dec-5: Israel's Metalink is Developing Chipset for 150Mbps Wireless LANs
2003_Dec-5: Matsushita's Production Capacity of Semiconductor Encapsulation Materials in Shanghai to be Tripled
2003_Dec-5: SEMI Forecast Reveals 38% Plus Growth Expected in 2004
2003_Dec-5: Soitec and Seika Corp Form Soitec Asian Joint Venture
2003_Dec-4: Asahi Kasei Develops Electric Storage Device as Hybrid of Capacitor, Li-ion Battery
2003_Dec-4: LG.Philips LCD Produces 1 Million Units of TFT-LCDs in China
2003_Dec-4: Renesas Technology Releases 32-Bit CISC MCU Supporting CAN for Automobiles
2003_Dec-4: Samsung Corning to Move into PDP Glass Market
2003_Dec-4: ANALYSIS: Market for Flat TVs Heats Up with Canon's Entry
2003_Dec-4: Philips Launches Next-Generation MPEG-2 Codec Aimed at DVD Recorders
2003_Dec-4: SingTel Announces Completion of Thailand-Indonesia-Singapore Cable
2003_Dec-3: Global Semiconductor Sales Achieve 23.3% YOY Growth in October
2003_Dec-3: Casio's Card-Type New Digital Camera is Popular: SalesWeek Ranking
2003_Dec-3: Japan's Large-Sized LCD TV Shipments in October More Than Doubled Y-O-Y
2003_Dec-3: [World DRAM Price] Dell, HP Purchases Provide Stability
2003_Dec-3: Sharp to Initiate On-Going Campaign to Hire New Graduates in China
2003_Dec-3: NTT DoCoMo to Promote Symbian OS for FOMA 3G Phones
2003_Dec-3: Atmel's Antenna Driver Targets Growing PEG Car Access Market
2003_Dec-3: BivarOpto's Panel Light Pipe Series Features Dual-Lens Geometry
2003_Dec-2: Casio Ventures into Organic EL Panels Driven by Amorphous Si TFT
2003_Dec-2: Terrestrial Digital TV Broadcasting Launched in Japan
2003_Dec-2: Visible Light Communications Consortium Established
2003_Dec-2: Fuji Photo Film Launches Compact Digital Camera with 6.3 Million Pixels
2003_Dec-2: LED EVOLUTION: New Alliances See Bright Future for White LEDs
2003_Dec-2: UTS, Alcatel Partner for Innovative Global Research Program
2003_Dec-2: IDT LVDS Fan-Out Buffers Feature Precise Clock-Signal Alignment
2003_Dec-1: Tokyo University Develops Flexible Artificial Skin for Robot
2003_Dec-1: Samsung Develops LCD for 57-Inch TV
2003_Dec-1: Sony to Separate Part of a Business for FeliCa Joint Venture with NTT DoCoMo
2003_Dec-1: Oki Launches New Sound Generator LSI for Mobile Phones in China
2003_Dec-1: New Japan Radio Samples Video Amp with Y/C Mixer and Low Pass Filter
2003_Dec-1: Hong Kong's ASTRI Announces Enhanced MPEG-4 Codec
2003_Dec-1: NS Launches Hot Swap Controller for Communications Systems
2003_Dec-1: Vodafone KK of Japan Striving to Recover from Setback
2003_Dec-1: Nanotech Products Just Years Away, 2 Trillion Yen Market Seen by '05


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