(Japanese Site)
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| Toshiba Develops Recycling Tech For Plastic IC Packages
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May 14, 1998 (TOKYO) -- Toshiba Corp. said that it developed a
type of semiconductor packaging technology using a thermoplastic
resin that can be recycled.
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Most conventional semiconductor packages are made of
thermosetting resins that are not easy to recycle. Previous
thermoplastic resins, which were easily recyclable, had low heat-
resisting properties and insufficient adherence to lead frames of
semiconductors.
After collaborating with Idemitsu Material, Toshiba developed a
new polyphenylene sulfide (PPS), a kind of thermoplastic resin,
and optimized the mold temperature and injection speed for its
injection molding process to solve those technical problems.
The new resin is fire-resistant and does not need a flame
retardant that might emit toxic gas. Its basic characteristics as
a semiconductor package material, including humidity resistance,
compare favorably with conventional thermosetting resins, company
officials said.
Toshiba said it will start sample shipments of transistors using
the new packages in October.
(Nikkei
Microdevices)
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