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  • Toshiba Develops Recycling Tech For Plastic IC Packages
  • May 14, 1998 (TOKYO) -- Toshiba Corp. said that it developed a type of semiconductor packaging technology using a thermoplastic resin that can be recycled.
    Most conventional semiconductor packages are made of thermosetting resins that are not easy to recycle. Previous thermoplastic resins, which were easily recyclable, had low heat- resisting properties and insufficient adherence to lead frames of semiconductors.

    After collaborating with Idemitsu Material, Toshiba developed a new polyphenylene sulfide (PPS), a kind of thermoplastic resin, and optimized the mold temperature and injection speed for its injection molding process to solve those technical problems.

    The new resin is fire-resistant and does not need a flame retardant that might emit toxic gas. Its basic characteristics as a semiconductor package material, including humidity resistance, compare favorably with conventional thermosetting resins, company officials said.

    Toshiba said it will start sample shipments of transistors using the new packages in October.

    (Nikkei Microdevices)

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    Updated: Wed May 13 19:55:13 1998