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(Nikkei BP Group)

(No.1 High-Tech News Site in Japanese)

  • Selete Pushes Evaluation of 300mm Wafer Transport System
  • December 8, 1998 (TOKYO) -- Semiconductor Leading Edge Technologies Inc. (Selete) said it is promoting the evaluation of an automatic transportation system for a 300mm wafer.
    Selete is an institute for jointly developing semiconductor manufacturing equipment using a 300mm wafer.

    Selete reported that at the 4th Selete 300mm Program Evaluation Progress Announcement held in Tokyo on Dec. 1 that evaluation measures can prevent specifications of transporting equipment from differing.

    Evaluation measures will be implemented in January 1999. The simulation was already made.

    Evaluation is to be made on an automatic guided vehicle (AGV), an overhead track system, a stocker, and other systems components. It will be made in two types, such as an open cassette and a clean box. Evaluated items include transporting capacity, transporting precision and a particle's effect.

    An automatic transport system is indispensable in constructing lines because the weight of a 300mm wafer lot is about 5kg in an open cassette and about 8kg in a clean box.

    Selete said mass production of a microchip using a 300mm wafer will ramp up in the middle of 2000, so it plans to complete the evaluation by March 2000.

    Related story: Development of 300mm Wafer Tech Aims at Production in 2000

    (Nikkei Microdevices)

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    Updated: Mon Dec 7 14:53:31 1998 PDT